As this likely will be the industry standard, wire inter-connect are going mostly for Copper wire instead of gold as for reason of Gold price is too high, and Copper has good reliability for the wire interconnect.ASM has launched a new and innovative product GoCu Copper wire bonder which has the following feature:
1. Cu wire bonding at the speed of Au and faster
2. Automatic wire rethread system for short tails leading to excellent MTBA.
3. Everybody can do Cu wire bonding with ASM GoCu, you do not need a Pro.
4. ASM Eagle Xtreme and iHawk Xtreme series wire bonders are upgradeable to GoCu.
ASM has run a Larges scale Seminar on 9 Nov at Bellevue Hotel in Alabang, more than 160 engineers, managers and directors from the Philippines Semiconductor houses came to join and share this 9 hours seminar.
The have seen the demo the GoCu machine and was surprise to see the Auto re-thread function of the machine that could possibly reduce dramatically the stoppages on the 2nd bond, a feature that the industry waiting for!
Hi Mr. Pham, Sorry there are some Google technical issue that I can not put comment on your question.,
Price of the equipment would be depending on what application, model you choose. ASM does have Single head or dual head wire bonder also wire bonder for LED application. For more information, you can mail to feverip266288@yahoo.com.hk
Thanks for the comment
Price of the equipment would be depending on what application, model you choose. ASM does have Single head or dual head wire bonder also wire bonder for LED application. For more information, you can mail to feverip266288@yahoo.com.hk
Thanks for the comment
HK Snob
